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1. general description the pcf2123 is a cmos 1 real-time clock (rtc) and calendar optimized for low power applications. data is transferred serially via a serial peripheral in terface (spi-bus) with a maximum data rate of 6.25 mbit/s. an alarm and timer function is also available providing the possibility to generate a wake-up signal on an interrupt pin. an of fset register allows fine tuning of the clock. 2. features and benefits ? real time clock provides year, month, day , weekday, hours, minutes, and seconds based on a 32.768 khz quartz crystal ? low backup current while ru nning: typical 100 na at v dd = 2.0 v and t amb =25 c ? resolution: seconds to years ? watchdog functionality ? freely programmable ti mer and alarm with interrupt capability ? clock operating voltage: 1.1 v to 5.5 v ? 3 line spi-bus with separate, but combinable data input and output ? serial interface at v dd =1.6vto5.5v ? 1 second or 1 minute interrupt output ? integrated osc illator load capacitors for c l =7pf ? internal power-on reset (por) ? open-drain interrupt and clock output pins ? programmable offset register for frequency adjustment 3. applications ? time keeping application ? battery powered devices ? metering ? high duration timers ? daily alarms ? low standby power applications pcf2123 spi real time clock/calendar rev. 03 ? 5 october 2010 product data sheet 1. the definition of the abbreviations and acronyms used in this data sheet can be found in section 19 .
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 2 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 4. ordering information [1] sawn 6 inch wafer on film frame carrier (ffc) for 6 inch wafer, see figure 37 on page 53 . [2] sawn 6 inch wafer with gold bumps on film frame carrier (ffc) for 8 inch wafer, see figure 38 on page 53 . 5. marking table 1. ordering information type number package name description version pcf2123ts/1 tssop14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm sot402-1 pcf2123bs/1 hvqfn16 plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 3 0.85 mm sot758-1 pcf2123u/10aa/1 pcf2123u/10 wire bond die; 12 bonding pads; 1.492 1.449 0.20 mm [1] pcf2123u/10 pcf2123u/12aa/1 pcf2123u/12aa wlcsp12; wafe r level chip size package; 12 bumps; 1.492 1.449 0.22 mm [2] pcf2123u/12aa pcf2123u/12ha/1 pcf2123u/12ha wlcsp12; wafe r level chip size package; 12 bumps; 1.492 1.449 0.17 mm [2] pcf2123u/12ha table 2. marking codes type number marking code pcf2123ts/1 pcf2123 pcf2123bs/1 123 pcf2123u/10aa/1 pc2123-1 pcf2123u/12aa/1 pc2123-1 pcf2123u/12ha/1 pc2123-1
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 3 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 6. block diagram fig 1. block diagram of pcf2123 013aaa223 pcf2123 oscillator 32.768 khz divider clock out interrupt clkout clkoe int offset function offset_register 0dh monitor power on reset watch dog spi interface osci ce scl sdi sdo osco v dd test v ss timer function timer_clkout 0eh countdown_timer 0fh control control_1 00h control_2 01h time seconds 02h minutes 03h hours 04h days 05h alarm function minute_alarm 09h hour_alarm 0ah day_alarm 0bh weekday_alarm 0ch weekdays 06h months 07h years 08h c osci c osco r pd
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 4 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 7. pinning information 7.1 pinning top view. for mechanical details, see figure 30 on page 46 . for mechanical details, see figure 31 on page 47 . fig 2. pin configuration for tssop14 (pcf2123ts/1) f ig 3. pin configuration for hvqfn16 (pcf2123bs/1) pcf2123 osci v dd osco clkout n.c. clkoe test n.c. int scl ce sdi v ss sdo 001aai551 1 2 3 4 5 6 7 8 10 9 12 11 14 13 001aai550 pcf2123 transparent top view ce sdi int scl test clkoe osco clkout v ss n.c. n.c. sdo osci n.c. n.c. v dd 4 9 3 10 2 11 1 12 5 6 7 8 16 15 14 13 terminal 1 index area viewed from active side. for mechanical details, see figure 32 on page 48 , figure 33 on page 49 , and figure 34 on page 50 . fig 4. pin configuration for pcf2123ux (bare die) 001aai54 4 7 6 osci v dd pcf2123u 8 osco 9 test 10 int 11 ce 12 v ss 5 clkout 4 clkoe 3 scl 2 sdi 1 sdo
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 5 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 7.2 pin description [1] the die paddle (exposed pad) is wired to v ss and should be electrically isolated. [2] the substrate (rear side of the die) is wired to v ss and should be electr ically isolated. table 3. pin description symbol pin description tssop14 (pcf2123ts/1) hvqfn16 (pcf2123bs/1) pcf2123ux (bare die) osci 1 16 7 oscillator input; high-im pedance node; minimize wire length between quartz and package osco 2 1 8 oscillator output; high-impedance node; minimize wire length between quartz and package n.c. 3, 11 6, 7, 14, 15 - do not connect an d do not use as feed through; connect to v dd if floating pins are not allowed test 4 2 9 test pin; not user accessible; connect to v ss or leave floating (internally pulled down) int 5 3 10 interrupt output (open-drain; active low) ce 6 4 11 chip enable input (active high) with internal pull down v ss 75 [1] 12 [2] ground sdo 8 8 1 serial data output, push-pull; high-impedance when not driving; can be connected to sdi for single wire data line sdi 9 9 2 serial data input; may float when ce is inactive scl 10 10 3 serial clock input; ma y float when ce is inactive clkoe 12 11 4 clkout enable or disable pin; enable is active high clkout 13 12 5 clock output (open-drain) v dd 14 13 6 supply voltage; positive or negative steps in v dd may affect oscillator performance; recommend 100 nf decoupling close to device (see figure 29 )
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 6 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8. functional description the pcf2123 contains 16 8-bit registers with an auto-incrementing address counter, an on-chip 32.768 khz oscillator with two integr ated load capacitors, a frequency divider which provides the source clock for the real time clock (rtc), a programmable clock output, and a 6.25 mbit/s spi-bus. an offset register allows fine tuning of the clock. all 16 registers are designed as addressable 8- bit parallel registers although not all bits are implemented. ? the first two registers (memory address 00h and 01h) are used as control registers. ? the memory addresses 02h through 08h are used as counters for the clock function (seconds up to years). the registers se conds, minutes, hours, days, weekdays, months, and years are all coded in binary coded decimal (bcd) format. when one of the rtc registers is written or read the conten ts of all counters are frozen. therefore, faulty writing or reading of the clock and calendar during a carry condition is prevented. ? addresses 09h through 0ch define the alarm condition. ? address 0dh defines the offset calibration. ? address 0eh defines the clock out and timer mode. ? address registers 0eh and 0fh are used for the countdown timer function. the countdown timer has four selectable source clocks allowing for countdown periods in the range from 244 s up to four hours. there are also two pre-defined timers which can be used to generate an interrupt once per second or once per minute. these are defined in register control_2 (01h). 8.1 low power operation minimum power operation will be achieved by reducing the number and frequency of switching signals inside the ic, i.e., low frequency timer clocks and a low frequency clkout will result in lower oper ating power. a second prime consideration is the series resistance r s of the quartz used. 8.1.1 power consumption with respect to quartz series resistance the series resistance acts as a loss element. low r s will reduce curr ent consumption further.
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 7 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.1.2 power consumptions with respect to timer mode four source clocks are poss ible for the timer. the 4.09 6 khz source clock will add the greatest part to the power consumpt ion. the selection of 64 hz, 1 hz or 1 ? 60 hz will be almost indistinguishable and add very little. configuration: clkout disabled, v dd = 3 v, timer clock set to 1 ? 60 hz. (1) i dd (na) minimum power mode. (2) maximum value for r s is 100 k . fig 5. i dd with respect to quartz r s rs (2) (k ) 0 100 80 40 60 20 001aai558 130 170 90 210 250 i dd (1) (na) 50 configuration: clkout disabled, quartz r s =15k . (1) i dd (na) minimum power mode. (2) timer clock = 4 khz. (3) timer clock = 64 hz, 1 hz, 1 ? 60 hz. fig 6. i dd with respect to timer clock selection v dd (v) 0 6 4 2 001aai559 200 100 300 400 i dd (1) (na) 0 (2) (3)
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 8 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.2 register overview 16 registers are available. the time registers are encoded in the binary coded decimal (bcd) format to simplify application use. ot her registers are either bit-wise or standard binary. [1] except in the case of software reset, see section 8.3.1.1 . table 4. registers overview bit positions labelled as - are not implemented and will return a 0 when read. the bit position labelled as -- is not implemented and will return a 0 or 1 when read. bit positions labelled with n should always be written with logic 0 [1] . address register name bit 7 6 5 4 3 2 1 0 control and status registers 00h control_1 ext_test n stop sr n 12_24 cie n 01h control_2 mi si msf ti_tp af tf aie tie time and date registers 02h seconds os seconds (0 to 59) 03h minutes -- minutes (0 to 59) 04h hours - - ampm hours (1 to 12) in 12 h mode hours (0 to 23) in 24 h mode 05h days - - days (1 to 31) 06h weekdays - - - - - weekdays (0 to 6) 07h months - - - months (1 to 12) 08h years years (0 to 99) alarm registers 09h minute_alarm ae_m minute_alarm (0 to 59) 0ah hour_alarm ae_h - ampm hour_alarm (1 to 12) in 12 h mode hour_alarm (0 to 23) in 24 h mode 0bh day_alarm ae_d - day_alarm (1 to 31) 0ch weekday_alarm ae_w - - - - weekday_alarm (0 to 6) offset register 0dh offset_register mode offset[6:0] timer registers 0eh timer_clkout - cof[2:0] te - ctd[1:0] 0fh countdown_timer countdown_timer[7:0]
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 9 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.3 control registers 8.3.1 register control_1 [1] default value. [2] for a software reset, 01011000 (58h) must be sent to register control_1 (see section 8.3.1.1 ). table 5. control_1 - control and status re gister 1 (address 00h) bit description bit symbol value description reference 7 ext_test 0 [1] normal mode section 8.10 1 external clock test mode 6 n - unused - 5stop 0 [1] the rtc source clock runs section 8.11 1 the rtc clock is stopped; rtc divider chain flip-flops are asynchronously set to logic 0; clkout at 32.768 khz, 16.384 khz or 8.192 khz is still available 4sr 0 [1] no software reset section 8.3.1.1 1 initiate software reset [2] ; this register will always return a 0 when read 3 n - unused - 2 12_24 0 [1] 24 hour mode is selected - 1 12 hour mode is selected 1cie 0 [1] no correction interrupt generated section 8.9 1 interrupt pulses will be generated at every correction cycle 0 n - unused -
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 10 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.3.1.1 reset a reset is automatically generated at power-o n. a reset can also be initiated with the software reset command. it is generally recommended to make a software reset after power-on. a software reset can be initiated by setting the bits 6, 4 and 3 in register control_1 logic 1 and all other bits logic 0 by sendi ng the bit sequence 01011000 (58h), see figure 7 . if this bit sequence is not correct, the software re set instruction will be ignored to protect the device from accidently being reset. when sending the software instruction, the other bits are not written. after reset, the followin g mode is entered: ? 32.768 khz on pin clkout active ? 24 hour mode is selected ? offset register is set to 0 ? no alarms set ? timer disabled ? no interrupts enabled (1) when ce is inactive, the interface is reset. fig 7. software reset command 001aai5 62 addr 00 hex software reset 58 hex r/w b7 0 b6 0 b5 0 b4 1 b3 0 b2 0 b1 0 b0 0 b7 0 b6 1 b5 0 b4 1 b3 1 b2 0 b1 0 b0 0 internal reset signal ce scl (1)
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 11 of 61 nxp semiconductors pcf2123 spi real time clock/calendar table 6. register reset values bits labeled as - are not implemented. bits label ed as x are undefined at power-on and unchanged by subsequent resets. address register name bit 7 6 5 4 3 2 1 0 00h control_1 00000000 01h control_2 00000000 02h seconds 1 xxxxxxx 03h minutes - xxxxxxx 04h hours - - xxxxxx 05h days - - xxxxxx 06hweekdays -----xxx 07h months - - - xxxxx 08h years xxxxxxxx 09h minute_alarm 1 xxxxxxx 0ah hour_alarm 1 - xxxxxx 0bh day_alarm 1 - xxxxxx 0chweekday_alarm1----xxx 0dhoffset_register00000000 0eh timer_clkout - 0000- 11 0fh countdown_timerxxxxxxxx
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 12 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.3.2 register control_2 [1] default value. table 7. control_2 - control and status re gister 2 (address 01h) bits description bit symbol value description reference 7mi 0 [1] minute interrupt is disabled section 8.6.3 1 minute interrupt is enabled 6si 0 [1] second interrupt is disabled 1 second interrupt is enabled 5msf 0 [1] no minute or second interrupt generated 1 flag set when minute or second interrupt generated; flag must be cleared to clear interrupt when ti_ip = 0 4ti_tp 0 [1] interrupt pin follows timer flags section 8.7.2 1 interrupt pin generates a pulse 3af 0 [1] no alarm interrupt generated section 8.5.5 1 flag set when alarm triggered; flag must be cleared to clear interrupt 2tf 0 [1] no countdown timer interrupt generated section 8.6.4 1 flag set when countdown timer interrupt generated; flag must be cleared to clear interrupt when ti_ip = 0 1aie 0 [1] no interrupt generated from the alarm flag section 8.7.3 1 interrupt generated when alarm flag set 0tie 0 [1] no interrupt generated from the countdown timer section 8.7.2 1 interrupt generated by the countdown timer
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 13 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.4 time and date function the majority of the registers are coded in the binary coded decimal (bcd) format. bcd is used to simplify application use. an example is shown for the seconds in table 9 . 8.4.1 register seconds [1] default value. 8.4.1.1 os flag the pcf2123 includes a flag (os in register seconds, see ta b l e 8 ) which is set whenever the oscillator is stopped (see figure 8 and figure 9 ). the flag will remain set until cleared by software. if the flag cannot be cleared, t hen the pcf2123 oscillator is not running. this method can be used to monitor the oscillator and to determine if the supply voltage has reduced to the point wh ere oscillation fails. table 8. seconds - seconds register (address 02h) bit description bit symbol value place value description 7 os 0 - clock integrity is guaranteed 1 [1] - clock integrity is not guaranteed; oscillator has stopped or been interrupted 6 to 4 seconds 0 to 5 ten?s place actual seconds coded in bcd format, see table 9 3 to 0 0 to 9 unit place table 9. seconds coded in bcd format seconds value (decimal) upper-digit (ten?s place) digit (unit place) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 00 00000000 01 00000001 02 00000010 : :::::::: 09 00001001 10 00010000 : :::::::: 58 01011000 59 01011001 fig 8. os set by failing v dd 001aai56 1 v dd v osc(min) t battery operation main supply
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 14 of 61 nxp semiconductors pcf2123 spi real time clock/calendar the oscillator may be st opped, for example, by grounding one of the oscillator pins, osci or osco. the oscillator is also considered to be stopped duri ng the time between power-on and stable crystal resonance. this time may be in the range of 200 ms to 2 s depending on crystal type, temperature and su pply voltage. at power-on the os flag is always set. 8.4.2 register minutes 8.4.3 register hours [1] hour mode is set by the 12_24 bit in register control_1. fig 9. os flag 001aai55 3 os = 1 and flag can not be cleared os = 1 and flag can be cleared os flag cleared by software os flag set when oscillation stops oscillation now stable t v dd oscillation os flag table 10. minutes - minutes register (address 03h) bit description bit symbol value place value description 7 - - - unused 6 to 4 minutes 0 to 5 ten?s place actual minutes coded in bcd format 3 to 0 0 to 9 unit place table 11. hours - hours register (address 04h) bit description bit symbol value place value description 7 to 6 - - - unused 12 hour mode [1] 5 ampm 0 - indicates am 1 - indicates pm 4 hours 0 to 1 ten?s place actual hours in 12 hour mode coded in bcd format 3to0 0to9 unit place 24 hour mode [1] 5 to 4 hours 0 to 2 ten?s place actual hours in 24 hour mode coded in bcd format 3to0 0to9 unit place
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 15 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.4.4 register days [1] the pcf2123 compensates for leap years by adding a 29 th day to february if the year counter contains a value which is exactly divisi ble by 4, including the year 00. 8.4.5 register weekdays [1] definition may be re-assigned by the user. 8.4.6 register months table 12. days - days register (address 05h) bit description bit symbol value place value description 7 to 6 - - - unused 5to4 days [1] 0 to 3 ten?s place actual day coded in bcd format 3to0 0to9 unit place table 13. weekdays - weekdays register (address 06h) bit description bit symbol value description 7 to 3 - - unused 2to0 weekdays 0to6 actual weekday values, see table 14 table 14. weekday assignments day [1] bit 2 1 0 sunday 0 0 0 monday 0 0 1 tuesday 0 1 0 wednesday 0 1 1 thursday 1 0 0 friday 1 0 1 saturday110 table 15. months - months register (address 07h) bit description bit symbol value place value description 7 to 5 - - - unused 4 months 0 to 1 ten?s place actual month coded in bcd format, see table 16 3 to 0 0 to 9 unit place
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 16 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.4.7 register years 8.4.8 setting and reading the time figure 10 shows the data flow and data dependencies starting from the 1 hz clock tick. table 16. month assignments in bcd format month upper-digit (ten?s place) digit (unit place) bit 4 bit 3 bit 2 bit 1 bit 0 january 0 0 0 0 1 february 0 0 0 1 0 march 0 0 0 1 1 april00100 may00101 june00110 july00111 august01000 september 0 1 0 0 1 october10000 november10001 december10010 table 17. years - years register (08h) bit description bit symbol value place value description 7 to 4 years 0 to 9 ten?s place actual year coded in bcd format 3to0 0to9 unit place fig 10. data flow of the time function 001aaf90 1 1 hz tick 12_24 hour mode weekday seconds minutes hours days leap year calculation months years
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 17 of 61 nxp semiconductors pcf2123 spi real time clock/calendar during read/write operations, the time counting circuits (memory locations 02h through 08h) are blocked. this prevents ? faulty reading of the clock and calendar during a carry condition ? incrementing the time regist ers during the read cycle after this read/write access is completed, the time circuit is released again and any pending request to increment the time counte rs that occurred during the read/write access is serviced. a maximum of 1 request can be stored; therefore, all accesses must be completed within 1 second (see figure 11 ). as a consequence of this method, it is very important to make a read or write access in one go, that is, setting or reading seconds through to years should be made in one single access. failing to comply with this method co uld result in the time becoming corrupted. as an example, if the time (seconds through to hours) is set in one access and then in a second access the date is set, it is possible that the time may increment between the two accesses. a similar problem exists when reading. a roll over may occur between reads thus giving the minutes from one moment and the hours from the next. therefore it is advised to read all time and date registers in one access. fig 11. access time for read/write operations t < 1 s 013aaa22 2 command data bus chip enable data data data
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 18 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.5 alarm function when one or more of these registers are loaded with a valid minute, hour, day, or weekday and its corresponding alarm enable bit (ae_x) is logic 0, then that information will be compared with the current mi nute, hour, day, and weekday. 8.5.1 register minute_alarm [1] default value. 8.5.2 register hour_alarm [1] default value. [2] hour mode is set by the 12_24 bit in register control_1. 8.5.3 register day_alarm [1] default value. table 18. minute_alarm - minute alarm register (address 09h) bit description bit symbol value place value description 7 ae_m 0 - minute alarm is enabled 1 [1] - minute alarm is disabled 6 to 4 minute_alarm 0 to 5 ten?s place minute alarm information coded in bcd format 3 to 0 0 to 9 unit place table 19. hour_alarm - hour alarm regist er (address 0ah) bit description bit symbol value place value description 7 ae_h 0 - hour alarm is enabled 1 [1] - hour alarm is disabled 6 - - - unused 12 hour mode [2] 5 ampm 0 - indicates am 1 - indicates pm 4 hour_alarm 0 to 1 ten?s place hour alarm information coded in bcd format when in 12 hour mode 3to0 0to9 unit place 24 hour mode [2] 5 to 4 hour_alarm 0 to 2 ten?s place hour alarm information coded in bcd format when in 24 hour mode 3to0 0to9 unit place table 20. day_alarm - day alarm register (address 0bh) bit description bit symbol value place value description 7 ae_d 0 - day alarm is enabled 1 [1] - day alarm is disabled 6 - - - unused 5 to 4 day_alarm 0 to 3 ten?s place day alarm information coded in bcd format 3 to 0 0 to 9 unit place
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 19 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.5.4 register weekday_alarm [1] default value. 8.5.5 alarm flag by clearing the msb, ae_x (a larm enable), of one or more of the alarm registers the corresponding alarm condition(s) are active. when an alarm occurs, af (register control_2, see ta b l e 7 ) is set logic 1. the asserted af can be used to generate an interrupt (int ). the af is cleared using the interface. the registers at addresses 09h through 0ch contain alarm information. when one or more of these registers is loaded with minute, hour, day, or weekday, and its corresponding alarm enable bit (ae_x) is logic 0, then that information is compared with the current minute, hour, day, and weekday. when all enabled comparisons first match, the alarm flag (af) is set logic 1. table 21. weekday_alarm - weekday alarm re gister (address 0ch) bit description bit symbol value description 7 ae_w 0 weekday alarm is enabled 1 [1] weekday alarm is disabled 6 to 3 - - unused 2 to 0 weekday_alarm 0 to 6 weekday alarm information coded in bcd format (1) only when all enabled alarm settings are matching. it?s only on increment to a matched case that the alarm flag is set, see section 8.5.5 . fig 12. alarm function block diagram 013aaa088 weekday alarm ae_w weekday time = day alarm ae_d day time = hour alarm ae_h hour time = minute alarm ae_m minute time = check now signal set alarm flag af (1) ae_m = 1 1 0 example
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 20 of 61 nxp semiconductors pcf2123 spi real time clock/calendar the generation of interrupts from the alarm function is controlled via bit aie (register control_2, see table 7 ). if bit aie is enabled, the int pin follows the condition of bit af. af will remain set until cleared by the interface. once af has be en cleared, it will only be set again when the time increments to match the alarm condition once more. alarm registers which have their ae_x bit logic 1 are ignored. generation of interrupts from the alarm function is described in section 8.7.3 . figure 13 , ta b l e 2 2 and ta b l e 2 3 show an example for clearing bit af, but leaving bit msf and bit tf unaffected. the flags are cleared by a write command, therefore bits 7, 6, 4, 1 and 0 must be written with their previous valu es. repeatedly re-writing these bits has no influence on the functional behavior. to prevent the timer flags being overwritten wh ile clearing bit af, logic and is performed during a write access. a flag is cleared by wr iting logic 0 whilst a flag is not cleared by writing logic 1. writing logic 1 will result in the flag value remaining unchanged. ta b l e 2 3 shows what instruction must be sent to clear bit af. in this example, bit msf and bit tf are unaffected. example where only the minute alarm is used and no other interrupts are enabled. fig 13. alarm flag timing table 22. flag location in register control_2 register bit 7 6 5 4 3 2 1 0 control_2--msf-aftf-- table 23. example to clear only af (bit 3) in register control_2 register bit 7 6 5 4 3 2 1 0 control_2 - - 1 - 0 1 - - 001aaf9 03 44 45 45 minute alarm minutes counter af int when aie = 1 46
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 21 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.6 timer functions the countdown timer has four selectable source clocks allowing for countdown periods in the range from 244 s to 4 h 15 min. there are also two pre-defined timers which can be used to generate an interrupt once per second or once per minute. for periods greater than 4 hours, the alarm function can be us ed. registers 01h, 0eh and 0fh are used to control the timer function and output. 8.6.1 register timer_clkout [1] values of cof[2:0] see table 35 . [2] default value. 8.6.2 register countdown_timer 8.6.3 minute and second interrupt the minute and second interrupts (bits mi and si) are pre-defined timers for generating periodic interrupts. the timers can be enabled independently from one another. however, a minute interrupt enabled on to p of a second inte rrupt will not be distinguishable since it will occur at the same time; see figure 14 . table 24. timer_clkout - timer control register (address 0eh) bit description bit symbol value description reference 7- - unused - 6 to 4 cof[2:0] [1] clkout control section 8.8 3 te 0 countdown timer is disabled section 8.6.4 1 countdown timer is enabled 2 - - unused 1 to 0 ctd[1:0] 00 4.096 khz co untdown timer source clock 01 64 hz countdown timer source clock 10 1 hz countdown timer source clock 11 [2] 1 ? 60 hz countdown timer source clock table 25. countdown_timer - countdown timer register (address 0ah) bit description bit symbol value description reference 7 to 0 countdown_timer[7:0] 0h to ffh countdown period in seconds: where n is the countdown value section 8.6.4 countdownperiod n sourceclockfrequency -------------------------------------------------------------- - =
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 22 of 61 nxp semiconductors pcf2123 spi real time clock/calendar the minute and second flag (bit msf) is set logic 1 when either the seconds or the minutes counter increments according to the currently enabled interrupt. the flag can be read and cleared by the interface. the st atus of bit msf does not affect the int pulse generation. if the msf flag is not cleared prior to the next coming interrupt period, an int pulse will still be generated. the purpose of the flag is to allow the controlling system to interrogate the pcf2123 and identify the source of the interrupt, i.e., minute or second, countdown timer or alarm. the duration of both of thes e timers will be affected by the r egister offset_register (see section 8.9 ). only when the offs et_register has the value 00h the periods will be consistent. in this example, ti_tp is set to logic 1 resulting in 1 ? 64 hz wide interrupt pulse and the msf flag is not cleared after an interrupt. fig 14. int example for mi and si table 26. effect of bits mi and si on int generation minute interrupt (bit mi) second interrupt (bit si) result 0 0 no interrupt generated 1 0 an interrupt once per minute 0 1 an interrupt once per second 1 1 an interrupt once per second table 27. effect of mi and si on msf minute interrupt (bit mi) second interrupt (bit si) result 0 0 msf never set 1 0 msf set when minutes counter increments 0 1 msf set when seconds counter increments 1 1 msf set when seconds counter increments 001aaf9 05 58 59 59 00 11 seconds counter minutes counter int when si enabled msf when si enabled int when only mi enabled msf when only mi enabled 12 00 01
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 23 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.6.4 countdown timer function the 8-bit countdown timer at address 0fh is controlled by the regist er timer_clkout at address 0eh. the register timer_clkout select s one of 4 source clock frequencies for the timer (4.096 khz, 64 hz, 1 hz, or 1 ? 60 hz) and enables or disables the timer. [1] when not in use, ctd must be set to 1 ? 60 hz for power saving. [2] time periods can be affected by correction pulses. remark: note that all timings which are genera ted from the 32.768 khz oscillator are based on the assumption that there is 0 ppm deviation. devi ation in oscillator frequency will result in deviation in timings. this is not applicable to interface timing. the timer counts down from a software-loaded 8-bit binary value, n. loading the counter with 0 stops the timer. values from 1 to 255 are valid. when the counter reaches 1, the countdown timer flag (bit tf) will be set and the counter automatically re-loads and starts the next timer period. reading the timer will return the current value of the countdown counter (see figure 15 ). if a new value of n is written be fore the end of the current timer period, then this value will take immediate effect. nxp does not recommend changing n without first disabling the counter (by setting bit te = 0). the update of n is asynchronous to the timer clock, table 28. bits ctd0 and ct d1 for timer frequency selection and countdown timer durations ctd[1:0] timer source clock frequency [1] delay minimum timer duration n= 1 maximum timer duration n=255 00 4.096 khz 244 s 62.256 ms 01 64 hz 15.625 ms 3.984 s 10 1 hz [2] 1 s 255 s 11 1 ? 60 hz [2] 60 s 4 h 15 min in this example it is assumed that the time r flag is cleared before the next countdown period expires and that the pin int is set to pulsed mode. fig 15. general countdown timer behavior 001aaf90 6 n duration of first timer period after enable may range from n ? 1 to n + 1 03 xx 02 01 03 02 01 03 02 01 03 n 03 xx countdown value, n timer source clock countdown counter te tf int
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 24 of 61 nxp semiconductors pcf2123 spi real time clock/calendar therefore changing it without setting bit te = 0 may result in a corrupted value loaded into the countdown counter which results in an undetermined countdown period for the first period. the countdown value n will, however, be correctly st ored and correc tly loaded on subsequent timer periods. when the countdown timer flag is set, an interrupt signal on int will be generated provided that this mode is enabled. see section 8.7.2 for details on how the interrupt can be controlled. when starting the timer for the first time, the first period will have an uncertainty which is a result of the enable instruction being ge nerated from the inte rface clock which is asynchronous from the timer source clock. subsequent ti mer periods will have no such delay. the amount of delay fo r the first timer period will depend on the chosen source clock, see ta b l e 2 9 . at the end of every countdown, the timer sets the countdown timer flag (bit tf). bit tf may only be cleared by software. the asserted bit tf can be used to generate an interrupt (int ). the interrupt may be generated as a pulsed signal every countdown period or as a permanently active signal whic h follows the condition of bit tf. bit ti_tp is used to control this mode selection and the interrupt output may be disabled with bit tie, see ta b l e 7 . when reading the timer, the current countdown value is returned and not the initial value n. since it is not possible to freeze the countdown timer counter during read back, it is recommended to read the register twice and check for consistent results. timer source clock frequency selection of 1 hz and 1 ? 60 hz will be affected by the offset_register. the duration of a program peri od will vary according to when the offset is initiated. for example, if a 100 s timer is se t using the 1 hz clock as source, then some 100 s periods will contain correction pulses an d therefor be longer or shorter depending on the setting of the offset_register. see section 8.9 to understand the operation of the offset_register. 8.6.5 timer flags when a minute or second interrupt occurs, bit msf is set logic 1. similarly, at the end of a timer countdown or alarm event, bit tf or af are set logic 1. these bits maintain their value until overwritten by software. if bo th countdown timer and minute or second interrupts are required in the application, the source of the interrupt can be determined by reading these bits. to prevent one flag being overwritten while clearing another a logical and is performed during a write access. a flag is cleared by writing logic 0 whilst a flag is not cleared by writing logic 1. writing logic 1 will result in the flag value remaining unchanged. table 29. first period delay for timer counter value n timer source clock minimum timer period maximum timer period 4.096 khz n n + 1 64 hz n n + 1 1 hz (n ? 1) + 1 ? 64 hz n + 1 ? 64 hz 1 ? 60 hz (n ? 1) + 1 ? 64 hz n + 1 ? 64 hz
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 25 of 61 nxp semiconductors pcf2123 spi real time clock/calendar three examples are given for clearing the fl ags. clearing the flags is made by a write command, therefore bits 7, 6, 4, 1 and 0 must be written with their previous values. repeatedly re-writing these bits has no influence on the functional behavior. ta b l e 3 1 , table 32 and ta b l e 3 3 show what instruction must be sent to clear the appropriate flag. clearing the alarm flag (bit af) operates in exactly the same way, see section 8.5.5 . table 30. flag location in register control_2 register bit 7 6 5 4 3 2 1 0 control_2 - - msf - af tf - - table 31. example to clear only tf (bit 2) in register control_2 register bit 7 6 5 4 3 2 1 0 control_2 - - 1 - 1 0 - - table 32. example to clear only msf (bit 5) in register control_2 register bit 7 6 5 4 3 2 1 0 control_2 - - 0 - 1 1 - - table 33. example to clear both tf and msf (bit 2 and bit 5) in register control_2 register bit 7 6 5 4 3 2 1 0 control_2 - - 0 - 1 0 - -
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 26 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.7 interrupt output an active low interrupt signal is available at pin int . operation is controlled via the bits of register control_2. interrupts may be sourced from four places: second and minute timer, countdown timer, alarm function or offset function. with bit ti_tp, the timer generated interrupts c an be configured to either generate a pulse or to follow the status of the interrupt flags (bits tf and msf). correction interrupt pulses are always 1 ? 128 second long. alarm interrupts a lways follow the condition of af. remark: note that the interrupts fr om the four sources are wired-or, meaning they will mask one another (see figure 16 ). when bits si, mi, tie, aie and cie are all disabled, pin int will remain high-impedance. fig 16. interrupt scheme 001aai55 5 seconds counter si 0 1 msf: minute second flag clear set pulse generator 1 clear trigger te si mi minutes counter countdown counter mi from interface: clear msf to interface: read msf af: alarm flag clear set to interface: read af 0 1 tf: timer clear set pulse generator 2 clear trigger tie int from interface: clear tf from interface: clear af set alarm flag, af offset circuit: add/substract 1/64 hz pulse to interface: read tf ti_tp aie e.g.aie pulse generator 3 clear trigger cie from interface: set cie 0 1
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 27 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.7.1 minute and second interrupts the pulse generator for the minute and second interrupt operates from an internal 64 hz clock and consequently generates a pulse of 1 ? 64 second in duration. if the msf flag is cleared before the end of the int pulse, then the int pulse is shortened. this allows the source of a sy stem interrupt to be cleared im mediately it is serviced, i.e., the system does not have to wa it for the completion of the pulse before continuing; see figure 17 . instructions for clearing msf are given in section 8.6.5 . the timing shown for clearing bit msf in figure 17 is also valid for the non-pulsed interrupt mode i.e. when bit ti_tp = 0, int may be shortened by setting both mi and si or msf to logic 0. 8.7.2 countdown timer interrupts the generation of interrupts from the countdown timer is controlled via bit tie. the pulse generator for the countdown timer interr upt also uses an internal clock, but this time it is dependent on the selected sour ce clock for the countdown timer and on the countdown value n. as a consequence, the wid th of the interrupt pulse varies (see ta b l e 3 4 ). [1] n = loaded countdown value. timer stopped when n = 0. if the tf flag is cleared before the end of the int pulse, then the int pulse is shortened. this allows the source of a sy stem interrupt to be cleared im mediately it is serviced, i.e., the system does not have to wa it for the completion of the pulse before continuing (see figure 18 ). instructions for clearing msf can be found in section 8.6.5 . (1) indicates normal duration of int pulse (bit ti_tp = 1) fig 17. example of shortening the int pulse by clearing the msf flag 001aaf9 08 58 seconds counter msf int scl instruction 59 clear instruction 8th clock (1) table 34. int operation (bit ti_tp = 1) source clock (hz) int period (s) n = 1 [1] n > 1 4096 1 ? 8192 1 ? 4096 64 1 ? 128 1 ? 64 1 1 ? 64 1 ? 64 1 ? 60 1 ? 64 1 ? 64
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 28 of 61 nxp semiconductors pcf2123 spi real time clock/calendar the timing shown for clearing bit tf in figure 18 is also valid for the non-pulsed interrupt mode, i.e., when bit ti_tp = 0; int may be shortened by setting bit tie to logic 0. 8.7.3 alarm interrupts the generation of interrupts from the ala rm function is controlled via bit aie (see table 7 ). if bit aie is enabled, the int pin follows the condition of bit af. clearing bit af will immediately clear int . no pulse generation is possible for alarm interrupts (see figure 19 ). 8.7.3.1 correction pulse interrupts interrupt pulses generated by correction events can be shortened by writing logic 1 to bit cie in register control_1. (1) indicates normal duration of int pulse (bit ti_tp = 1). fig 18. example of shortening the int pulse by clearing the tf flag 001aaf9 09 01 countdown counter cdtf int scl instruction n clear instruction 8th clock (1) example where only the minute alarm is used and no other interrupts are enabled. fig 19. af timing 001aaf9 10 44 45 minute counter minute alarm af int scl instruction 45 clear instruction 8th clock
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 29 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.8 clock output a programmable square wave is available at pin clkout. operation is controlled by the cof[2:0] bits in the register timer_clkout. frequencies of 32.768 khz (default) down to 1 hz can be generated for use as a system cloc k, microcontroller clock, input to a charge pump, or for calibration of the oscillator. pin clkout is an open-drain output and en abled at power-on. when disabled the output is high-impedance. the duty cycle of the selected clock is not c ontrolled. however, due to the nature of the clock generation, all will be 50 : 50 except the 32.768 khz frequencies. the stop bit function can also affect the clkout signal, depending on the selected frequency. when the stop bit is set to logic 1, the clkout pin will generate a continuous low for those frequencies that can be stopped. for more details of the stop bit function see section 8.11 . [1] duty cycle definition: % high-level time : % low-level time. [2] 1 hz clock pulses will be affe cted by offset correction pulses. 8.8.1 clkoe pin the clkoe pin can be used to block the clko ut function and force the clkout pin to an high-impedance state. the effect is the same as setting cof[2:0] = 111. table 35. clkout frequency selection bits cof[2:0] clkout frequency (hz) typical duty cycle [1] effect of stop bit 000 32768 60 : 40 to 40 : 60 no effect 001 16384 50 : 50 no effect 010 8192 50 : 50 no effect 011 4096 50 : 50 clkout = low 100 2048 50 : 50 clkout = low 101 1024 50 : 50 clkout = low 110 1 [2] 50 : 50 clkout = low 111 clkout = high-z - -
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 30 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.9 offset register the pcf2123 incorporates an offset register (address 0dh) which can be used to implement several functions, such as: ? ageing adjustment ? temperature compensation ? accuracy tuning the offset is made once every two hours in the normal mode, or once every hour in the course mode. each lsb will introduce an offset of 2.17 ppm for normal mode and 4.34 ppm for course mode. the values of 2.17 ppm and 4.34 ppm are based on a nominal 32.768 khz clock. the offset value is cod ed in two?s complement giving a range of +63 lsb to ? 64 lsb. [1] default mode. the correction is made by adding or subtra cting 64 hz clock correction pulses, thereby changing the period of a single second. in normal mode, the correction is triggered once per two hours and then correction pulses are applied once per minute until the programmed correction values have been implement. in course mode, the correction is triggered once per hour and then correction pulses are applied once per minute up to a maximum of 60 minutes. when correction values greater than 60 are used, additional correction pulses are made in the 59th minute (see table 38 ). table 36. register offset_register offset[6:0] offset value in decimal offset value in ppm normal mode mode = 0 course mode mode = 1 0 1 1 1 1 1 1 +63 +136.71 +273.42 0 1 1 1 1 1 0 +62 +134.54 +269.08 :::: 0000010 +2 +4.34 +8.68 0000001 +1 +2.17 +4.34 0000000 0 [1] 00 1111111 ? 1 ? 2.17 ? 4.34 1111110 ? 2 ? 4.34 ? 8.68 :::: 1000001 ? 63 ? 136.71 ? 273.42 1000000 ? 64 ? 138.88 ? 277.76 table 37. example of converting the offset in ppm to seconds offset in ppm seconds per day week month year 2.17 0.187 1.31 5.69 68.2 4.34 0.375 2.62 11.4 136
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 31 of 61 nxp semiconductors pcf2123 spi real time clock/calendar [1] example is given in a time range from 2:00 to 2:59. [2] correction int pulses are 1 ? 128 s wide. for multiple pulses they are repeated at 1 ? 64 s interval. it is possible to monitor when correction pulses are applied. the correction interrupt enable mode (bit ci e) will generate a 1 ? 128 second pulse on int for every correction applied. in the case where multiple correction pulses are applied, a 1 ? 128 second interrupt pulse will be generated and repeated every 1 ? 64 seconds. correction is applied to the 1 hz clock. any ti mer or clock output using a frequency of 1 hz or below will also be affected by the correction pulses. table 38. correction pulses for course mode correction value hour:minute [1] correction pulses on int per minute [2] +1 or ? 1 02:00 1 02:01 to 02:59 0 +2 or ? 2 02:00 1 02:01 1 02:02 to 02:59 0 +3 or ? 3 02:00 1 02:01 1 02:02 1 02:03 to 02:59 0 ::: +59 or ? 59 02:00 to 02:58 1 02:59 0 +60 or ? 60 02:00 to 02:59 1 +61 or ? 61 02:00 to 02:58 1 02:59 2 +62 or ? 62 02:00 to 02:58 1 02:59 3 +63 or ? 63 02:00 to 02:58 1 02:59 4 ? 64 02:00 to 02:58 1 02:59 5
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 32 of 61 nxp semiconductors pcf2123 spi real time clock/calendar table 39. effect of correction pulses frequency (hz) effect of correction clkout 32768 no effect 16384 no effect 8192 no effect 4096 no effect 2048 no effect 1024 no effect 1effected time source clock 4096 no effect 64 no effect 1effected 1 ? 60 effected
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 33 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.10 external clock test mode a test mode is available which allo ws for on-board testing. in th is mode it is possible to set up test conditions and control the operation of the rtc. the test mode is entered by setting bit ext_test in register control_1. then pin clkout becomes an input. the test mode replaces the internal clock signal with the signal applied to pin clkout. the signal applied to pin clkout should have a minimum pulse width of 300 ns and a maximum period of 1000 ns. the internal cl ock, now sourced from clkout, is divided down to 1 hz by a 2 6 divide chain called a prescaler. the prescaler can be set into a known state by using bit stop. when bit stop is set, the prescaler is reset to 0. (stop must be cleared before the prescaler can operate again.) from a stop condition, the fi rst 1 second increment will take place after 32 positive edges on pin clkout. thereafter, every 64 posit ive edges will cause a 1 second increment. remark: entry into test mode is not synchroni zed to the internal 64 hz clock. when entering the test mode, no assumption as to the state of the prescaler can be made. operation example: 1. set ext_test test mode (regis ter control_1, bit ext_test = 1). 2. set stop (control_1, bit stop = 1). 3. clear stop (control_1, bit stop = 0). 4. set time registers to desired value. 5. apply 32 clock pulses to pin clkout. 6. read time registers to see the first change. 7. apply 64 clock pulses to pin clkout. 8. read time registers to see the second change. repeat 7 and 8 for additional increments.
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 34 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.11 stop bit function the function of the stop bit is to allow for ac curate starting of the time circuits. the stop bit function will caus e the upper part of the prescaler (f 2 to f 14 ) to be held in reset and thus no 1 hz ticks will be gene rated. the time circuits can then be set and will not increment until the stop bit is released (see figure 21 and ta b l e 4 0 ). the stop bit function will not affe ct the output of 32.768 kh z, 16.384 khz or 8.192 khz (see section 8.8 ). the lower two stages of the prescaler (f 0 and f 1 ) are not reset and because the spi-bus is asynchronous to the crystal oscillator, the ac curacy of re-starting th e time circuits will be between 0 and one 8.192 khz cycle (see figure 21 ). the first increment of the time circuits is between 0.499878 s and 0.500000 s after stop bit is released. the uncertainty is caused by the prescaler bits f 0 and f 1 not being reset (see table 40 ). fig 20. stop bit functional diagram 001aai556 oscillator 32768 hz 16384 hz oscillator stop detector f 0 f 1 f 13 reset f 14 reset f 2 reset 2 hz 1 hz 1024 hz 16384 hz 8192 hz 1 hz tick stop clkout source oscillator stop flag 8192 hz 4096 hz fig 21. stop bit release timing 001aaf91 2 8192 hz stop released 0 s to 122 s
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 35 of 61 nxp semiconductors pcf2123 spi real time clock/calendar [1] f 0 is clocked at 32.768 khz. table 40. first increment of time circuits after stop bit release bit prescaler bits [1] 1hz tick time comment stop f 0 f 1 -f 2 to f 14 hh:mm:ss clock is running normally 0 01-0 0001 1101 0100 12:45:12 prescaler counting normally stop bit is activated by user. f 0 f 1 are not reset and values cannot be predicted externally 1 xx-0 0000 0000 0000 12:45:12 prescaler is reset; time circuits are frozen new time is set by user 1 xx-0 0000 0000 0000 08:00:00 prescaler is reset; time circuits are frozen stop bit is released by user 0 xx-0 0000 0000 0000 08:00:00 prescaler is now running xx-1 0000 0000 0000 08:00:00 - xx-0 1000 0000 0000 08:00:00 - xx-1 1000 0000 0000 08:00:00 - : :: 11-1 1111 1111 1110 08:00:00 - 00-0 0000 0000 0001 08:00:01 0 to 1 transition of f 14 increments the time circuits 10-0 0000 0000 0001 08:00:01 - : :: 11-1 1111 1111 1111 08:00:01 - 00-0 0000 0000 0000 08:00:01 - 10-0 0000 0000 0000 08:00:01 - : :: 11-1 1111 1111 1110 08:00:01 - 00-0 0000 0000 0001 08:00:02 0 to 1 transition of f 14 increments the time circuits 013aaa352 0.499878 s to 0.500000 s 1 s
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 36 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.12 3-line serial interface data transfer to and from the device is made via a 3-wire spi-bus (see ta b l e 4 1 ). the data lines for input and output are split. the data input and output lines can be connected together to facilitate a bidirectional data bus. the chip enable signal is used to identify the transmitted data. each data transfer is a byte, wi th the most significant bit (msb) sent first (see figure 23 ). the transmission is controlled by the active high chip enable signal ce. the first byte transmitted is the command by te. subsequent bytes will be ei ther data to be written or data to be read. data is sampled on the rising edge of the clock and transferred internally on the falling edge. the command byte defines the address of th e first register to be accessed and the read/write mode. the address counter will auto increm ent after every access and will rollover to zero after the last re gister is accessed. the read/write bit (r/w ) defines if the following bytes will be read or write information. table 41. serial interface symbol function description ce chip enable input when low, the interface is reset; pull-down resistor included; active input may be higher than v dd , but may not be wired permanently high scl serial clock input when ce is low, this input may float; input may be higher than v dd sdi serial data input when ce is low, input may float; input may be higher than v dd ; input data is sampled on the rising edge of scl sdo serial data output push-pull output; drives from v ss to v dd ; output data is changed on the falling edge of scl; will be high-z when not driving; may be connected directly to sdi fig 22. sdi, sdo configurations fig 23. data transfer overview 001aai56 0 sdi two wire mode sdo sdi single wire mode sdo 001aaf9 14 command data bus chip enable data data data
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 37 of 61 nxp semiconductors pcf2123 spi real time clock/calendar in figure 24 , the register seconds is set to 45 sec onds and the register minutes is set to 10 minutes. in figure 25 , the months and years registers are read . in this example, pins sdi and sdo are not connected together. for this configuration, it is important that pin sdi is never left floating. it must always be driven either high or low. if pin sdi is left open, high i dd currents may result. short tr ansition periods in the order of 200 ns will not cause any problems. table 42. command byte definition bit symbol value description 7r/w data read or data write selection 0 write data 1 read data 6 to 4 sa 001 subaddress; other codes will cause the device to ignore data transfer 3 to 0 ra 0h to fh register address range fig 24. serial bus write example 001aaf915 xx address counter ce sdi scl 02 03 04 seconds data 45 bcd minutes data 10 bcd r/w addr 02 hex b7 0 b6 0 b5 0 b4 1 b3 0 b2 0 b1 1 b0 0 b7 0 b6 1 b5 0 b4 0 b3 0 b2 1 b1 0 b0 1 b7 0 b6 0 b5 0 b4 1 b3 0 b2 0 b1 0 b0 0
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 38 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 8.12.1 interface watchdog timer during read/write operations, the time counting circuits are frozen. to prevent a situation where the accessing device becomes locked and does not clear the interface by setting pin ce low, the pcf2123 has a built in watch dog timer. should the interface be active for more than 1 s from the time a valid subad dress is transmitted, then the pcf2123 will automatically clear the interface and allow the ti me counting circuits to continue counting. ce must return low once more before a new data transfer can be executed. fig 25. serial bus read example 001aaf916 xx address counter ce sdo sdi scl 07 08 09 months data 11 bcd years data 06 bcd r/w addr 07 hex b7 1 b6 0 b5 0 b4 1 b3 0 b2 1 b1 1 b0 1 b7 0 b6 0 b5 0 b4 1 b3 0 b2 0 b1 0 b0 1 b7 0 b6 0 b5 0 b4 0 b3 0 b2 1 b1 1 b0 0 a. correct data transfer: read or write b. incorrect data transfer; read or write fig 26. interface watchdog timer 001aai56 3 valid sub-address running time counters wd timer data ce wd timer running time counters frozen running data t w(ce) < 1 s data data 001aai56 4 valid sub-address running time counters wd timer data ce wd timer running data transfer fail wd trips time counters frozen running data 1 s < t w(ce) < 2 s data data
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 39 of 61 nxp semiconductors pcf2123 spi real time clock/calendar the watchdog is implemented to prevent the excessive loss of time due to interface access failure e.g. if main power is remove d from a battery backed-up system during an interface access. each time the watchdog period is exceeded, 1 s will be lost from the time counters. the watchdog will trigger between 1 s and 2 s after receiving a valid subaddress. 9. internal circuitry fig 27. device diode protection diagram of pcf2123 001aai55 2 sdo sdi scl clkout clkoe v dd osci osco test int ce v ss pcf2123
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 40 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 10. limiting values [1] with respect to v ss . [2] pass level; human body model (hbm) according to ref. 7 ? jesd22-a114 ? [3] pass level; latch-up testing, according to ref. 8 ? jesd78 ? at maximum ambient temperature (t amb(max) ). [4] according to the nxp store and transport requirements (see ref. 10 ? nx3-00092 ? ) the devices have to be stored at a temperature of +8 c to +45 c and a humidity of 25 % to 75 %. for long term storage products deviant conditions are described in that document. table 43. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v dd supply voltage [1] ? 0.5 +6.5 v i dd supply current ? 50 +50 ma v i input voltage [1] ? 0.5 +6.5 v v o output voltage [1] ? 0.5 +6.5 v i i input current ? 10 +10 ma i o output current ? 10 +10 ma p tot total power dissipation - 300 mw v esd electrostatic discharge voltage hbm [2] - 3000 v i lu latch-up current [3] -200ma t stg storage temperature [4] ? 65 +150 c t amb ambient temperature operating device ? 40 +85 c
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 41 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 11. static characteristics table 44. static characteristics v dd = 1.1 v to 5.5 v; v ss =0v; t amb = ? 40 c to +85 c; f osc = 32.768 khz; quartz r s =15k ; c l = 7 pf; unless otherwise specified. symbol parameter conditions min typ max unit supplies v dd supply voltage for clock data integrity; spi-bus inactive [1] 1.1 - 5.5 v t amb =25 c-0.9-v spi-bus active 1.6 - 5.5 v i dd supply current spi-bus active f scl = 4.5 mhz; v dd =5v - 250 400 a f scl = 1.0 mhz; v dd =3v -3080 a spi-bus inactive; clkout disabled [2] t amb =25 c; v dd =2.0v - 100 - na t amb =25 c; v dd =3.0v -110-na t amb =25 c; v dd =5.0v - 120 - na spi-bus inactive; clkout disabled; t amb = ? 40 cto +85 c [2] v dd = 2.0 v - - 330 na v dd = 3.0 v - - 350 na v dd = 5.0 v - - 380 na spi-bus inactive; clkout enabled at 32 khz; t amb =25 c v dd = 2.0 v - 260 - na v dd = 3.0 v - 340 - na v dd = 5.0 v - 520 - na spi-bus inactive; clkout enabled at 32 khz; t amb = ? 40 c to +85 c v dd = 2.0 v - - 450 na v dd = 3.0 v - - 550 na v dd = 5.0 v - - 750 na inputs v il low-level input voltage - - 0.3v dd v v ih high-level input voltage 0.7v dd --v v i input voltage on pins ce, sdi, scl, osci, clkoe, clkout ? 0.5 - +5.5 v
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 42 of 61 nxp semiconductors pcf2123 spi real time clock/calendar [1] for reliable oscillator start at power-on: v dd =v dd(min) +0.3v. [2] timer source clock = 1 ? 60 hz, level of pins ce, sdi and scl is v dd or v ss . [3] in case of an esd event, the value may increase slightly. [4] implicit by design. [5] refers to external pull-up voltage. [6] integrated load capacitance, c l(itg) , is a calculation of c osci and c osco in series. i li input leakage current v i =v dd or v ss on pins sdi, scl, osci, clkoe, clkout [3] -0- a v i =v ss on pin ce ? 10 - a r pd pull-down resistance on pin ce - 240 550 k c i input capacitance on pins sdi, scl, clkoe and ce [4] --7pf outputs v o output voltage on pins clkout and int [5] ? 0.5 - +5.5 v on pin osco ? 0.5 - +5.5 v on pin sdo ? 0.5 - v dd +0.5 v v oh high-level output voltage on pin sdo 0.8v dd -v dd v v ol low-level output voltage on pin sdo v ss -0.2v dd v on pins clkout and int ; v dd =5v; i ol =1.5ma v ss -0.4v i oh high-level output current output source current; v oh =4.6v; v dd = 5 v on pin sdo 1.5--ma i ol low-level output current output sink current; v ol =0.4v; v dd = 5 v on pins int , sdo and clkout 1.5--ma i lo output leakage current v o =v dd or v ss [3] -0- a c l(itg) integrated load capacitance on pins osco and osci [6] 3.3 7 14 pf r s series resistance - - 100 k table 44. static characteristics ?continued v dd = 1.1 v to 5.5 v; v ss =0v; t amb = ? 40 c to +85 c; f osc = 32.768 khz; quartz r s =15k ; c l = 7 pf; unless otherwise specified. symbol parameter conditions min typ max unit c litg () c osci c osco ? () c osci c osco + () ------------------------------------------- - =
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 43 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 12. dynamic characteristics table 45. spi-bus characteristics v ss =0v; t amb = ? 40 c to +85 c. all timing values are valid within the operating supply voltage and temperature range and referenced to v il and v ih with an input voltage swing of v ss to v dd . symbol parameter conditions v dd = 1.6 v v dd = 2.4 v v dd = 3.3 v v dd = 5.0 v unit min max min max min max min max timing characteristics (see figure 28 ) f clk(scl) scl clock frequency - 2.9 - 4.54 - 5.71 - 8.0 mhz t scl scl time 345 - 220 - 175 - 125 - ns t clk(h) clock high time 90 - 50 - 45 - 40 - ns t clk(l) clock low time 200 - 120 - 95 - 70 - ns t r rise time for scl signal - 100 - 100 - 50 - 50 ns t f fall time for scl signal - 100 - 100 - 50 - 50 ns t su(ce) ce set-up time 40 - 35 - 30 - 25 - ns t h(ce) ce hold time 40 - 30 - 25 - 15 - ns t rec(ce) ce recovery time 30 - 25 - 20 - 15 - ns t w(ce) ce pulse width measured after valid subaddress is received - 0.99 - 0.99 - 0.99 - 0.99 s t su set-up time set-up time for sdi data 10-5-3-2-ns t h hold time hold time for sdi data 25 - 10 - 8 - 5 - ns t d(r)sdo sdo read delay time bus load = 50 pf - 190 - 108 - 85 - 60 ns t dis(sdo) sdo disable time no load value; bus will be held up by bus capacitance; use rc time constant with application values - 70 - 45 - 40 - 27 ns t t(sdi-sdo) transition time from sdi to sdo to avoid bus conflict 0 - 0 - 0 - 0 - ns
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 44 of 61 nxp semiconductors pcf2123 spi real time clock/calendar fig 28. spi-bus timing 001aai554 r/w sa2 ra0 b7 b6 b0 b7 b6 b0 b0 b6 b7 sdi sdo sdo hi z hi z sdi scl ce write read t w(ce) 80% 20% t clk(l) t f t h(ce) t rec(ce) t dis(sdo) t d(r)sdo t t(sdi-sdo) t r t h t su t clk(h) t scl t su(ce)
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 45 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 13. application information a 1 farad super capacitor combined with a low v f diode can be used as a standby or back-up supply. with the rtc in its minimum power conf iguration i.e. timer off and clkout off, the rtc may operate for weeks. fig 29. typical application diagram 001aai55 7 clkoe v dd clkout v ss osci osco ce scl sdi sdo pcf2123 int 100 nf 1 f supercapacitor
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 46 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 14. package outline fig 30. package outline sot402-1 (tssop14) of pcf2123ts/1 unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.72 0.38 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot402-1 mo-153 99-12-27 03-02-18 w m b p d z e 0.25 17 14 8 a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm sot402 -1 a max. 1.1 pin 1 index
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 47 of 61 nxp semiconductors pcf2123 spi real time clock/calendar fig 31. package outline sot758-1 (hvqfn16) of pcf2123bs/1 terminal 1 index area 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 3.1 2.9 d h 1.75 1.45 y 1 3.1 2.9 1.75 1.45 e 1 1.5 e 2 1.5 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot758-1 mo-220 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot758- 1 h vqfn16: plastic thermal enhanced very thin quad flat package; no leads; 1 6 terminals; body 3 x 3 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 58 16 13 12 9 4 1 x d e c b a e 2 02-03-25 02-10-21 terminal 1 index area 1/2 e 1/2 e a c c b v m w m e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1)
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 48 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 15. bare die outline fig 32. bare die outline of pcf2123u/10aa/1 references outline version european projection issue date iec jedec jeita pcf2123u/10 w ire bond die; 12 bonding pads; 1.492 x 1.449 x 0.20 mm pcf2123u/1 0 08-07-16 08-07-24 unit mm nom 0.20 1.492 1.296 0.09 0.081 0.09 a dimensions (mm are the original dimensions) d (1) e (1) 1.449 e d p 1 (2) p 2 (3) p 3 (2) p 4 (3) 0.081 0 scale 1 mm a notes 1. dimension includes saw lane 2. p 1 and p 3 : pad size 3. p 2 and p 4 : passivation opening p 4 p 3 p 2 p 1 detail x d e e d x y 0 0 12 11 10 9 8 7 6 5 4 3 2 1 x table 46. bonding pad locations all x/y coordinates represent the position of the center of each pad with respect to the center (x/y = 0) of the chip; see figure 32 . symbol pad coordinates x y sdo 1 648.0 ? 575.0 sdi 2 648.0 ? 377.0 scl 3 648.0 ? 179.0 clkoe 4 648.0 171.2 clkout 5 648.0 369.2 v dd 6 648.0 625.7 osci 7 ? 648.0 639.0 osco 8 ? 648.0 421.9 test 9 ? 648.0 ? 25.9 int 10 ? 648.0 ? 223.9 ce 11 ? 648.0 ? 441.0 v ss 12 ? 648.0 ? 639.0
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 49 of 61 nxp semiconductors pcf2123 spi real time clock/calendar fig 33. bare die outline of pcf2123u/12aa/1 references outline version european projection issue date iec jedec jeita pcf2123u/12aa - - - - - - - - - pcf2123u_12aa_do 09-10-19 10-07-13 unit mm max nom min 0.22 0.018 0.015 0.012 1.492 1.449 1.296 0.198 0.09 0.09 0.084 0.081 0.078 a dimensions note 1. dimension includes saw lane. 2. p 1 and p 3 : pad size. 3. p 2 and p 4 : bump size. w lcsp12: wafer level chip size package; 12 bumps; 1.492 x 1.449 x 0.22 mm pcf2123u/12a a a 1 a 2 0.2 d (1) e (1) ep 1 (2) p 2 (3) 0.084 0.081 0.078 p 3 (2) p 4 (3) 0 0.5 1 mm scale x detail y p 2 p 1 p 4 p 3 detail x a 1 a 2 a y 0 x 0 y d e e e pc2123-1 7 8 9 10 11 12 6 5 4 3 2 1
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 50 of 61 nxp semiconductors pcf2123 spi real time clock/calendar fig 34. bare die outline of pcf2123u/12ha/1 references outline version european projection issue date iec jedec jeita pcf2123u/12ha - - - - - - - - - pcf2123u_12ha_do 09-10-19 10-07-13 unit mm max nom min 0.17 0.018 0.015 0.012 1.492 1.449 1.296 0.198 0.09 0.09 0.084 0.081 0.078 a dimensions note 1. dimension includes saw lane. 2. p 1 and p 3 : pad size. 3. p 2 and p 4 : bump size. w lcsp12: wafer level chip size package; 12 bumps; 1.492 x 1.449 x 0.17 mm pcf2123u/12h a a 1 a 2 0.15 d (1) e (1) ep 1 (2) p 2 (3) 0.084 0.081 0.078 p 3 (2) p 4 (3) 0 0.5 1 mm scale x detail y p 2 p 1 p 4 p 3 detail x a 1 a 2 a y 0 x 0 y d e e e pc2123-1 7 8 9 10 11 12 6 5 4 3 2 1
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 51 of 61 nxp semiconductors pcf2123 spi real time clock/calendar [1] the x/y coordinates of the alignment mark loca tion represent the position of the ref point (see figure 35 ) with respect to the center (x/y = 0) of the chip; see figure 32 and figure 33 . [2] the x/y values of the dimensions represent the ext ensions of the alignment mark in direction of the coordinate axis (see figure 35 ). table 47. bump locations all x/y coordinates represent the position of the center of each pad with respect to the center (x/y = 0) of the chip; see figure 33 and figure 34 . symbol bump coordinates x y sdo 1 648.0 ? 575.0 sdi 2 648.0 ? 377.0 scl 3 648.0 ? 179.0 clkoe 4 648.0 171.2 clkout 5 648.0 369.2 v dd 6 648.0 625.7 osci 7 ? 648.0 639.0 osco 8 ? 648.0 421.9 test 9 ? 648.0 ? 25.9 int 10 ? 648.0 ? 223.9 ce 11 ? 648.0 ? 441.0 v ss 12 ? 648.0 ? 639.0 table 48. alignment mark dimension and location coordinates x y location [1] 693 ? 516.2 dimension [2] 16 m13 m fig 35. alignment mark 013aaa231 ref y x
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 52 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 16. handling information all input and output pins are protected ag ainst electrostatic discharge (esd) under normal handling. when handling metal-oxide semiconductor (mos) devices ensure that all normal precautions are taken as described in jesd625-a , iec 61340-5 or equivalent standards. 17. packing information (1) die marking code. seal ring plus gap to active circuit ~18 m. fig 36. pcf2123ux wafer information 013aaa232 saw lane ~18 m 45 m 70 m ~18 m detail x 1.449 mm 1.492 mm 1 1 1 1 x straight edge of the wafer (1) table 49. pcf2123ux wafer information type number wafer thickness wafer diameter marking of bad die pcf2123u/10aa/1 200 6 inch inking pcf2123u/12aa/1 200 6 inch wafer mapping pcf2123u/12ha/1 150 6 inch wafer mapping
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 53 of 61 nxp semiconductors pcf2123 spi real time clock/calendar fig 37. film frame carrier (ffc) for 6 inch wafer (pcf2123u/10aa/1) 013aaa350 1.2 +0 mm ? 0.1 73.68 mm 71.79 mm ? 193.50 mm ? 225.50 mm 214.50 mm 214.50 mm 0.25 metal frame plastic film straight edge of the wafer fig 38. film frame carrier (ffc) for 8 inch wafer (pcf2123u/12aa/1 and pcf2123u/12ha/1) 013aaa35 1 2.6 mm 60.2 mm 63.5 mm ? 250 mm ? 296 mm 276 mm 276 mm 0.3 plastic frame plastic film straight edge of the wafer
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 54 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 18. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 ?surface mount reflow soldering description? . 18.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electr ical circuits. the soldered joint provides both the mechanical and the electrical connection. th ere is no single sold ering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for fine pitch smds. reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 18.2 wave and reflow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased pr obability of bridging. the reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. leaded packages, packages with solder balls, and leadless packages are all reflow solderable. key characteristics in both wave and reflow soldering are: ? board specifications, in cluding the board finish , solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivit y level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 18.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhe sive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath specifications, including temperature and impurities
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 55 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 18.4 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 39 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature) and coolin g down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 5 0 and 51 moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 39 . table 50. snpb eutectic process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 < 2.5 235 220 2.5 220 220 table 51. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 56 of 61 nxp semiconductors pcf2123 spi real time clock/calendar for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 19. abbreviations msl: moisture sensitivity level fig 39. temperature profiles for large and small components 001aac84 4 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 52. abbreviations acronym description cmos complementary metal oxide semiconductor bcd binary coded decimal esd electrostatic discharge ffc film frame carrier hbm human body model lsb least significant bit mm machine model mos metal oxide semiconductor msb most significant bit msl moisture sensitivity level pcb printed-circuit board rtc real time clock smd surface mount device spi serial peripheral interface
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 57 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 20. references [1] an10365 ? surface mount reflow soldering description [2] an10706 ? handling bare die [3] an10853 ? handling precautions of esd sensitive devices [4] iec 60134 ? rating systems for electronic tu bes and valves and analogous semiconductor devices [5] iec 61340-5 ? protection of electronic devices from electrostatic phenomena [6] ipc/jedec j-std-020d ? moisture/reflow sensitiv ity classification for nonhermetic solid state surface mount devices [7] jesd22-a114 ? electrostatic discharge (esd) sensitivity testing human body model (hbm) [8] jesd78 ? ic latch-up test [9] jesd625-a ? requirements for handling elec trostatic-discharge-sensitive (esds) devices [10] nx3-00092 ? nxp store and transport requirements [11] snv-fa-01-02 ? marking formats integrated circuits
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 58 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 21. revision history table 53. revision history document id release date data sheet status change notice supersedes pcf2123 v.3 20101005 product data sheet - pcf2123_2 modifications: ? the format of this data sheet has been redesi gned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? added new product type. ? added ffc information for 8 inch wafer ( figure 38 ). ? corrected misspelled timing information in section 8.11 . pcf2123_2 20091204 product data sheet - pcf2123_1 pcf2123_1 20081119 product data sheet - -
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 59 of 61 nxp semiconductors pcf2123 spi real time clock/calendar 22. legal information 22.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 22.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 22.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
pcf2123 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 5 october 2010 60 of 61 nxp semiconductors pcf2123 spi real time clock/calendar non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully in demnifies nxp semi conductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive appl ications beyond nxp semiconductors? standard warranty and nxp semicond uctors? product specifications. bare die ? all die are tested on compliance with their related technical specifications as stated in this data sheet up to the point of wafer sawing and are handled in accordance with the nxp semiconductors storage and transportation conditions. if there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. there are no post-packing tests performed on individual die or wafers. nxp semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. accordingly, nxp semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. it is the responsibility of the customer to test and qualify their application in which the die is used. all die sales are conditioned upon and subject to the customer entering into a written die sale agreement with nxp semiconductors through its legal department. 22.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 23. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors pcf2123 spi real time clock/calendar ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 5 october 2010 document identifier: pcf2123 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 24. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 functional description . . . . . . . . . . . . . . . . . . . 6 8.1 low power operation . . . . . . . . . . . . . . . . . . . . 6 8.1.1 power consumption with respect to quartz series resistance. . . . . . . . . . . . . . . . . . . . . . . . 6 8.1.2 power consumptions with respect to timer mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 8.2 register overview . . . . . . . . . . . . . . . . . . . . . . . 8 8.3 control registers . . . . . . . . . . . . . . . . . . . . . . . . 9 8.3.1 register control_1 . . . . . . . . . . . . . . . . . . . . . . 9 8.3.1.1 reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 8.3.2 register control_2 . . . . . . . . . . . . . . . . . . . . . 12 8.4 time and date function . . . . . . . . . . . . . . . . . . 13 8.4.1 register seconds . . . . . . . . . . . . . . . . . . . . . . 13 8.4.1.1 os flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8.4.2 register minutes. . . . . . . . . . . . . . . . . . . . . . . 14 8.4.3 register hours . . . . . . . . . . . . . . . . . . . . . . . . 14 8.4.4 register days . . . . . . . . . . . . . . . . . . . . . . . . . 15 8.4.5 register weekdays. . . . . . . . . . . . . . . . . . . . . 15 8.4.6 register months . . . . . . . . . . . . . . . . . . . . . . . 15 8.4.7 register years . . . . . . . . . . . . . . . . . . . . . . . . 16 8.4.8 setting and reading the time. . . . . . . . . . . . . . 16 8.5 alarm function. . . . . . . . . . . . . . . . . . . . . . . . . 18 8.5.1 register minute_alarm . . . . . . . . . . . . . . . . . . 18 8.5.2 register hour_alarm . . . . . . . . . . . . . . . . . . . 18 8.5.3 register day_alarm . . . . . . . . . . . . . . . . . . . . 18 8.5.4 register weekday_alarm . . . . . . . . . . . . . . . . 19 8.5.5 alarm flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8.6 timer functions . . . . . . . . . . . . . . . . . . . . . . . . 21 8.6.1 register timer_clkout. . . . . . . . . . . . . . . . . . . 21 8.6.2 register countdown_timer . . . . . . . . . . . . . . . 21 8.6.3 minute and second interrupt . . . . . . . . . . . . . . 21 8.6.4 countdown timer function . . . . . . . . . . . . . . . . 23 8.6.5 timer flags . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 8.7 interrupt output . . . . . . . . . . . . . . . . . . . . . . . . 26 8.7.1 minute and second interrupts . . . . . . . . . . . . . 27 8.7.2 countdown timer interrupts. . . . . . . . . . . . . . . 27 8.7.3 alarm interrupts . . . . . . . . . . . . . . . . . . . . . . . 28 8.7.3.1 correction pulse interrupts . . . . . . . . . . . . . . . 28 8.8 clock output . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.8.1 clkoe pin . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.9 offset register . . . . . . . . . . . . . . . . . . . . . . . . 30 8.10 external clock test mode . . . . . . . . . . . . . . . . 33 8.11 stop bit function . . . . . . . . . . . . . . . . . . . . . . 34 8.12 3-line serial inte rface . . . . . . . . . . . . . . . . . . . 36 8.12.1 interface watchdog timer . . . . . . . . . . . . . . . . 38 9 internal circuitry . . . . . . . . . . . . . . . . . . . . . . . 39 10 limiting values . . . . . . . . . . . . . . . . . . . . . . . . 40 11 static characteristics . . . . . . . . . . . . . . . . . . . 41 12 dynamic characteristics. . . . . . . . . . . . . . . . . 43 13 application information . . . . . . . . . . . . . . . . . 45 14 package outline. . . . . . . . . . . . . . . . . . . . . . . . 46 15 bare die outline . . . . . . . . . . . . . . . . . . . . . . . . 48 16 handling information . . . . . . . . . . . . . . . . . . . 52 17 packing information . . . . . . . . . . . . . . . . . . . . 52 18 soldering of smd packages . . . . . . . . . . . . . . 54 18.1 introduction to soldering. . . . . . . . . . . . . . . . . 54 18.2 wave and reflow soldering. . . . . . . . . . . . . . . 54 18.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . 54 18.4 reflow soldering . . . . . . . . . . . . . . . . . . . . . . 55 19 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 56 20 references. . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 21 revision history . . . . . . . . . . . . . . . . . . . . . . . 58 22 legal information . . . . . . . . . . . . . . . . . . . . . . 59 22.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 59 22.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 22.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 59 22.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 60 23 contact information . . . . . . . . . . . . . . . . . . . . 60 24 contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

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